Session Categories
Materials, Processes & Integration
- Metallization for advanced interconnects; local interconnects; contacts; metal gates; through silicon vias; power semiconductors
- Dielectrics; porous ULK; hybrid materials; pore sealing; pore stuffing; MOF, patterning; cleaning; restoration; surface functionalization
- Metal or dielectric liners and diffusion barriers; etch-stop; capping
Deposition PVD; CVD; ALD; ELD; ECD; SAMs, reflow; e-beam
- Patterning processes and integration; double & triple patterning; advanced etching techniques; Atomic Layer Etching (ALE)
- Planarization; CMP; slurry; pad; anti-corrosion methods
- Device integration and novel architectures; local interconnects
- Silicides and germanides
- Contacts to III-V materials: for CMOS, power, LED, Laser applications
- Materials for memories and memristive devices
- 1D and 2D Nanomaterials (graphene; carbon nanotubes; nanowires; nanodots)
- Packaging materials and technologies;
Advanced Characterization and Modeling techniques
- Analytical techniques; defect inspection; x-ray/electron tomography; spectroscopy; microscopy; scanning probe methods
- Reliability and failure analysis; lifetime extrapolation methodologies; chip-package interaction (CPI)
- Modeling and simulation of process steps; equipment; interconnect systems; material properties; nanoscale devices; reliability
Applications including nanoscale
- Alternative interconnects; optical interconnects and wireless systems
- 3D integration; COW, WOW; thinning; bonding; TSV; micro-bumps
- System-on-chip and system-in-package
- Memories devices (MRAM; FeRAM; CBRAM; PCRAM, ReRAM)
- Advanced devices; single electron device; tunnel FET, memristive devices
- Energy harvesting/storage; MEMS/NEMS; sensors and actuators